Multilayered Flex material, coupled with an unmatched ability for ever smaller bending zones and higher packaging densities- your unused space in your products’ formation will surely shrink by design. In this technological sphere, the area which is rigid is not frigid. Thus, these smaller and smaller bend zones’ technological solutions are therefore no mind bender.
Are you fixed yet? The flexible multilayer Printed Circuit Boards’ (PCBs) solutions, birthchild of Micro Systems Technologies’ (MST’s) versatile company DYCONEX, are here to bend to your will. To choose these bendy technological advancements are no mind bender, however the all new virtual showroom for such hi-tech is surely is. With Smaller and smaller bend zones within reach, very thin flexible materials composing the PCBs (and as a result potentially higher packaging densities compared to the more rigid-flex PCB with prepregs), vibration resistant metal core boards and tight line tolerances for signal integrity- this wonderful technology will be bended to your will.
You surely can’t stay distant towards the outstanding ability to construct the rigid area of the module as a multilayer bendable material flex-fest or a singular layer of glass reinforced material for optimal rigid apparatus for the desired assembly area. These “changeable” solutions are especially designed for optimal performance in varied technological building blocks such as the wide range of reflow assembly technologies. Namely flip chip, Chip On Board (COB), Chip Scale Package (CSP) or Ball Grid Array (BGA). With this technology, denser packaging solutions are becoming the new standard. As the bend precision gets tighter, this technology is clearly neatly suited for the reliable, small, extra-small and microelectronics hardware sectors.
The possibilities are (almost) endless with the bonded combinations of wide ranges of wire bonding, surface finishes and Flexible materials to boot. The results speak for themselves with an Ultra-fine line down to 25/35 µm lines/spaces and Ultra-HDI microvia technology down to 40 µm blind via. The only question that remains is: are you already fixed on this flex-tech?