Trusted by industrial applications and environs, the CFast 3D NAND memory family is here to stay. Additionally, these solutions are an idle choice for automation, transportation, medical systems, and edge-computing devices. With this new improvement, the industry is reintroduced with a refreshed multilayered solution. Built for a brave new AI world and for reliable continuation of operations.
Face the facts. Our tech-driven world is changing before our eyes. The Artificial Intelligence (AI) and edge computing push influences every aspect of our daily lives. From the personal to the big-scale industrial- everything had changed. Still, some constant things are ready to meet the challenge. Thus, the CFast™ solutions family is expanding. E.D.E. Electronics is proud to present the new F-75 and F-78 solutions.
As both solutions are based on industrial-grade 3D NAND storage tech, they combine a 112-layer industrial-grade 3D TLC NAND with a DRAM cache and a rugged design built for predictable, reliable operation. Brainchild of storage tech composer Swissbit, these solutions offer extended temperature support, advanced power-fail protection, end-to-end data path protection, and Static Ransom Access Memory Error Correction code (SRAM ECC). Not only that, both solutions are specified for industrial use at operating temperatures ranging from -40 °C to +85 °C.
What is the best new age-new edge computing storage tech for you? It so happens that each of the new solutions is designed to address different, and therefore compensating, industrial needs. While the F-75 solution uses TLC NAND and offers 32, 64, 128, 256, and 512 GB capacities. In parallel, the F-78 operates with pseudo Single Level Cell (pSLC) technology with increased over-provisioning for heightened endurance in 32, 64, and 128 GB capacities.
Therefore, the F-75 fits seamlessly for read-intensive or mixed workloads such as PLC systems, HMI terminals, or edge gateways managing operating systems and configuration data. Meanwhile, the F-78 solution provides maximum endurance for write-heavy applications, including sensor data loggers or predictive-maintenance systems.
In addition, the AI world is driven by industrial-grade grid. By definition, these industrial workloads regularly produce continuous or irregular bursts of write activity. Phenomena which strain storage endurance. This new CFast series mitigates this through its optimized combination of industrial NAND flash, DRAM caching, Redundant Array of Independent Discs (RAID) mechanisms, and a Triple Level Cell (TLC)-direct operating mode ensuring consistent endurance characteristics.
In continuation, these solutions minimize field failures caused by harsh operating conditions or sudden power loss via their outstanding capabilities. Specifically designed to address the acute needs of the new challenging AI world. Namely, a world consisting of Navigation services, image data processing and vision analysis to harsh computing hardware operating in extreme conditions.
Additionally, these solutions are a pinpoint fit for operations that render heightened data security an fundamental requirement. Such as medical equipment, industrial control systems, or avionics, aerospace, and other ruggedized platforms. The F-75 and F-78 series integrate AES-256 encryption, TCG Opal 2.0, Secure Boot, and Crypto Erase. All models are UL-certified, meeting safety criteria widely required in North American industrial markets.