The same great ball grade array has just got a brand-new upgrade. A new feature, a new game. This team of mini memorable memory “ball players” has received much-anticipated reinforcements. Now, these tough module series can truly be called “team players”. Now, there is a new generation of meaningful players in the technological game court.
Multilayered Flex material, coupled with an unmatched ability for ever smaller bending zones and higher packaging densities- your unused space in your products’ formation will surely shrink by design. In this technological sphere, the area which is rigid is not frigid. Thus, these smaller and smaller bend zones’ technological solutions are therefore no mind bender.
Extra-small, vibration resistant and available in capacities from 16 to 256 GB- this BGA solution will give you the lead you’ve been waiting for. Ideal for a wide range of applications such as POI/POS terminals, industrial automation to medical systems. The EM-30 series, designed with an e.MMC-5.1 standard interface, has been unleashed. The all new […]
The all new 3.2cm² BGA packaged 3D NAND SSD PCIe single industrial component gives new meaning to reliability for small size embedded components. Up to 480GB capacity and 4 lane PCIe 3.1 / NVMe 1.3 specification, high performance to boot is guaranteed. Small size embedded systems, factory automation, routers and switches, Internet of Things (IoT), […]