In-house integration & optimization, assembly capabilities from the component to board level and varied flexible options to boot- you know your ideas are being taken care of. Fully adjustable and in-tune to every need, these highly reliable, and highly customizable, Printed Circuit Boards (PCBs) and modules, by electronics innovator MST group, will surely answer every […]
+10 flexible layers available, standardized slick space and lines features, small bend zones and various stiffener materials for easier assembly formations- you will be able to introduce your product’s attractive physique. Depending on your design, your product can not only be good-looking, but also Noble. Are you ready to Flex some electric muscles? With these […]
High voltage and high frequency compatible materials? Check. Encompassing assembly solutions? Check. Rigorous testing for high reliability? Check, check, check. From conception to integration, these tailored Assembly solutions are the new engine for the engineer’s vision. Ready, steady- go! “Only the hard. Only the strong”. we may not be talking about an esteemed graphic novel, […]
The solution seems as the natural choice for Microwave application and RF. Regardless of the presence of moisture, the abilities of this tech gem remain nearly untouched. Be amazed, be very amazed. The advanced Liquid Crystal Polymer (LCP) substrates’ solution and support, by MST’s company Dyconex, will deliver a fundamental upgrade to the HF and […]
These various customized packaging solutions offered for wide spectrum of materials are the equivalent of bringing a gun to a swordfight. Wide range for basic packaging will highlight the E in engineer. The various customized packaging solutions for a wide range of base materials, by MST’s division MSE, will bring your A game in the […]
With an extremely wide range of assembly equipment, for any board material for electronic modules, complex and miniaturized, MSE gets the job done. MSE, from tech powerhouse MST, is your best supplier in the field for advanced assembly capabilities. With extensive assembly equipment for every need and inspection technologies to boot- the opportunity to assemble […]
Innovations, progress and ingenuity. All of the former can be found in the field of Flex Printed Circuits. At least regarding these solutions. The Flex Printed Circuits (FPC) field has finally been mastered for every engineer’s enjoyment. With innovations by DYCONEX, a MST division, which have redefined the boundaries of tech creativity and the dictionary’s […]
The full mastery of Flex and Flex Rigidized PCB tech can be yours. The cutting-edge multilayer tech is now fully tailored to your needs with DYCONEX. Multilayered Flex PCBs, HDI, 3D miniaturization, and ultra-fine line cables. These are just some of the cutting edge mastery of the multilayered Flex and Flex Rigidized PCB tech by […]
Multilayered substrate technology offering excellent RF and Microwave performance characteristics. The low sintering temperature (900c approximately) allows co-firing with highly conductive metals such as silver and gold. Low Temperature Co-Fired Ceramic (LTCC) Substrates are supported by Tech board gizmo MSE, division of tech provider MST, to alleviate and upgrade RF and Microwave performance. How? the […]