Basic packaging solutions

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These various customized packaging solutions offered for wide spectrum of materials are the equivalent of bringing a gun to a swordfight. Wide range for basic packaging will highlight the E […]

F-800 CFast

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SATA Protocol and Compact Flash form factor intertwined, The all new F-800 CFast memory module series is the new go to solution for various applications. From Industrial Automation to Medical […]

Wide range for any board

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With an extremely wide range of assembly equipment, for any board material for electronic modules, complex and miniaturized, MSE gets the job done. MSE, from tech powerhouse MST, is your […]

The Flexed PCB

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The full mastery of Flex and Flex Rigidized PCB tech can be yours. The cutting-edge multilayer tech is now fully tailored to your needs with DYCONEX. Multilayered Flex PCBs, HDI, […]

The Low Temperature Co-Fired Ceramic

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Multilayered substrate technology offering excellent RF and Microwave performance characteristics. The low sintering  temperature (900c approximately) allows co-firing with  highly conductive metals such as silver and gold. Low Temperature Co-Fired […]

Generation G

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Available from the end of 2020, The all new CFexpress 2.0 Type B cards are all you need for a brand new performance experience in the field of plugged memory […]