The Organic superior solution for RF
The solution seems as the natural choice for Microwave application and RF. Regardless of the presence of moisture, the abilities of this tech gem remain nearly untouched. Be amazed, be […]
Category: main
Transformer innovation, based on NiZn magnetic core
Designed for coupling-decoupling signals for power lines communication according to IEC 15118 and IEC 61851-1 for charging system communication. Provided a lower cost competitive product using Linear Winding versus Toroidal […]
Memory card solutions, extended
SLC-based SD, microSD and CompactFlash™ memory cards solutions have been renewed for your enjoyment. With same product architecture, but with new names, as the previous S-200(u) and C-300 products, their […]
Basic packaging solutions
These various customized packaging solutions offered for wide spectrum of materials are the equivalent of bringing a gun to a swordfight. Wide range for basic packaging will highlight the E […]
F-800 CFast
SATA Protocol and Compact Flash form factor intertwined, The all new F-800 CFast memory module series is the new go to solution for various applications. From Industrial Automation to Medical […]
Wide range for any board
With an extremely wide range of assembly equipment, for any board material for electronic modules, complex and miniaturized, MSE gets the job done. MSE, from tech powerhouse MST, is your […]
The Flex Printed Circuits, Mastered
Innovations, progress and ingenuity. All of the former can be found in the field of Flex Printed Circuits. At least regarding these solutions. The Flex Printed Circuits (FPC) field has […]
The Flexed PCB
The full mastery of Flex and Flex Rigidized PCB tech can be yours. The cutting-edge multilayer tech is now fully tailored to your needs with DYCONEX. Multilayered Flex PCBs, HDI, […]
The Low Temperature Co-Fired Ceramic
Multilayered substrate technology offering excellent RF and Microwave performance characteristics. The low sintering temperature (900c approximately) allows co-firing with highly conductive metals such as silver and gold. Low Temperature Co-Fired […]
Generation G
Available from the end of 2020, The all new CFexpress 2.0 Type B cards are all you need for a brand new performance experience in the field of plugged memory […]