The same great ball grade array has just got a brand-new upgrade. A new feature, a new game. This team of mini memorable memory “ball players” has received much-anticipated reinforcements. Now, these tough module series can truly be called “team players”. Now, there is a new generation of meaningful players in the technological game court.
“Good, better, best. Never let it rest. Until your good is better and your better is best”. Beats us to contradict the immortal ball-related words of an iconic ball player such as “The big fundamental”. these words that defined a moment in time of ball game history can now define a brand new generation of tech ball “players”. A memory tech worthy of their praise. No one could hard pass this memory storage solution that can hard pass information with a durable and reliable frame. Introducing the fresh new launch of the EM-30 memory solution series, equipped with an embedded Multi-Media Card 5.1 (e.MMC-5.1) standardized interface. This new much anticipated update to the EM-30 memory solutions series, made by memory solutions legend Swissbit, is the ideal choice for a vast range of application and their needs. These include POS/POI terminals, routers and switches, through to solutions for industrial automation, the Internet of Things (IoT), automotive, medical systems, and even the gaming industry.
This Ball Grade Array (BGA) product series uses industrial grade 3D-NAND and is standardized with a 153 ball BGA design. Although a 100 BGA option is also available. Available to double it’s storage capacity as each storage capacity “jump” from 16 to 256 GB, this BGA is the best response to date for the increasing need in systems for ultra-small, vibration-resistant designs with escalating memory capacity requirements. Highly durable, this memory module can “dribble two balls at once” with industrial operating temperatures ranging between -40°C to 85°C, and automotive operating temperatures starting from -40°C to 105°C (although still not for the basic 16GB kind). talk about putting in the work. Not only that, this memory modules series is completely downward compatible, and neatly features a remote secure firmware update option and an extended lifetime expectation. Designated for the tough conditions of soldered-down components, these modules offer the option to access detailed information about the consumption of the write cycles and internal resources via standard access to the e.MMC registers without the need for special access methods or drivers.
In Addition, these modules’ structure and firmware support automatic background data refresh of read-only areas that for instance occur with boot media, all in a BGA setting. This feature, along with strong error correction, ensures that data availability is always highly reliable. Even after prolonged periods when the device was unused under exposure to high temperatures. With an enhanced Power Loss Protection (PLP) mechanism in an event of a sudden power shortage, this module family are standing on the lines of the memory game court. Ready to enter the game.
Enough about ball play, let’s talk about the score. Non-volatile, and highly calculated, this memory modules family can do sequential data rates of up to 300 MB/s for read and 230 MB/s for write as well as 40 and 42 k IOPS for read and write random access. The same Serial Advanced Technology Attachment Solid StateDrives (SATA SSDs) performance in significantly smaller costs and smaller size requirements. That’s what we call a smart purchase. Of course, if needed, these players go back to the fundamentals. they can be partitioned by the user into several Triple Level Cell (TLC) and pseudo Single Level Cell (pSLC) segments. If the maximum possible endurance of the NAND is required, an EM-36 variant preconfigured to 100% pSLC is offered. The memory technology game court will surely never be the same again.