These various customized packaging solutions offered for wide spectrum of materials are the equivalent of bringing a gun to a swordfight. Wide range for basic packaging will highlight the E in engineer.
The various customized packaging solutions for a wide range of base materials, by MST's division MSE, will bring your A game in the engineering field. With I/O configurations and housing types, the tech developments by MSE are the most advanced in their field.
Not only that, these major steps in tech progress enable, for example, the production of Die-Size Ball Grid Arrey (DSBGA) using transfer molding technology in small and medium sized volumes.