With a 10+ layer count, an elegant flexible design and a significant weight loss coupled with a volume utilization optimization process- your next-to-go PCB solution is going to be Flex, Ultra-flex. With Ultra-thin base materials, and a wide range of surface finishes, the material properties of these solutions enable smaller application form factors to fabricate ever smaller and smaller.
“This is a Board’s world. But it would be nothing, nothing without layers or a curve”. All right, all right. We might have changed the lyrics for an alltime Soul music classic for an Engineer’s ear. But don’t be stiff, cause’ being flexed is a gift. Especially in the hardware world. In the tech world, every solution has to stay in shape in order to stay in the (tech) game. In the Printed Circuit Boards (PCBs) engineering world, miniaturization and process optimization are a game changer. Everyone wants their product to shine, are you ready to make it twist and turn to make your best design? introducing the high density interconnect (HDI) and the Ultra- high density interconnect (Ultra-HDI) by DYCONEX, a bendable devision from magic maker MST. Ready to cope with high end design, and high end intensity production-wise, don’t you fret. Cause’ you ain’t seen nothing yet.
Ultra-thin base materials, highly reliable and extremely robust multilayer flex/microvia substrates and Wrap-around boards with an expanding variety of optional surface finishes are just a few of your production options. Furthermore, with an ever attentive top notch team to address your every need on your tech quest from the macro to the micro, your solution is bound to become a tech classic.
If that’s not enough, how about changing tracks? Featuring a full flex PCB production capabilities, you can bet the standard rigidized-flex PCBs with prepregs just got upstaged. This option features extra-thin flexible materials, smaller bending zones and thinner constructions- higher packaging densities are now within reach. In this engineered tech symphony, the rigid area can have multiple layers of flex material or a single layer of glass reinforced material to rigidize the assembly area. Due to the thin construction more advanced assembly know-how is needed to handle the delivery panels. Specific assembly trays can help to handle the PCB through the assembly line.
With a temperature spectrum for processing from -25°C to +125°C, Small bend zones in multiple shapes with laser technology, a wide Combination of reflow and wire bonding technology possible such as Al wire wedge-wedge bonding or thermosonic ball-wedge gold wire bonding- you can begin to play from start to finish. The experts are waiting for you.