Not all that glitter is gold, but perhaps will be diamond-based? A new lighting packaging solution is ready to revolutionize the LED, and the illumination, industry. High power operability, coupled with high endurance material, is designated to combat acute technological void. With 10 times the thermal conductivity values of its ceramic based contemporaries, are you ready to be diamond struck?
“Shine Bright like a diamond”: every element has it’s decline. The lighting elements are no exception. But the show must go on. And it must go better, stronger, longer. For tough challenges, you need tougher tech. and the challenges for high power Light Emitting Diode (LED) illumination solutions are severe. Heat dissipation has always been a critical hinderance in LED solutions performance. Especially in light of the great strides of LED technology towards high luminous efficiency and high power, high-power LED packaging technology. Poor heat dissipation in cases of high-power LED solutions in complex application scenarios usually led to critical performance malfunction such as accelerated light decay and reduced stability. Now, through innovative material-centred engineering, these major obstacles may be a thing of the past. Introducing the new Diamond-based substrate Ultra-high Power Density Packaging solution. now, your product can truly shine.
The groundbreaking lighting packaging technology, adopted and moulded by lighting future bringer Refond Optoelectronics, meets the need for high power, reliability driven LEDs packaging in demanding environments. Such scenarios include automotive headlights, outdoor high-intensity lighting, and even stage lighting systems. Thus, enabling ore possibilities for the development and application of high-power LEDs.
In some high demand fields, the move from ceramic to diamond based is not all glitter, but practical. As the diamond-based substrate offers thermal conductivity values of up to 1800W/(m·K), 10 times more than that of its ceramic counterpart. Such capabilities are critically important in a technological field such as automotive headlights, as conventional ceramic material-based casing often result in severe light decay, shortened lifespan, or suffer the titular at hand. Namely, burnout due to poor heat dissipation. No longer. This high-power LED glamoured packaging enables continuous brightness improvement under high power while ensuring the LED chip operates stably at higher power levels.
Fully compatible with mainstream market standards, allowing direct replacement of existing solutions, this new product offers a variety of specifications. with the smallest single-lamp size measuring just 5*5mm, It meets the requirements of various high-efficiency application scenarios, especially suitable for situations requiring high brightness and long-term illumination. Thus, reduction in maintenance costs is guaranteed.