LTCC Substrates Hybrid & MCM Capabilities & Assemblies

Full range of Hybrid & MCM capabilities & Assemblies:

  •  Design and manufacture of microelectronic substrates & assemblies.
  •  Hybrid & MCM design & manufacturing.
  • Design & manufacture of complex LTCC substrates.
  •  Advanced assembly and semiconductor packaging processes.
  •  Development and manufacturing of complete electronic modules of active implants, SMD assembly and test.
  • Miniaturization.

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