The Organic superior solution for RF

The solution seems as the natural choice for Microwave application and RF. Regardless of the presence of moisture, the abilities of this tech gem remain nearly untouched. Be amazed, be very amazed. The advanced Liquid Crystal Polymer (LCP) substrates’ solution and support, by MST’s company Dyconex, will deliver a fundamental upgrade to the HF and […]

Basic packaging solutions

These various customized packaging solutions offered for wide spectrum of materials are the equivalent of bringing a gun to a swordfight. Wide range for basic packaging will highlight the E in engineer. The various customized packaging solutions for a wide range of base materials, by MST’s division MSE, will bring your A game in the […]

Wide range for any board

With an extremely wide range of assembly equipment, for any board material for electronic modules, complex and miniaturized, MSE gets the job done. MSE, from tech powerhouse MST, is your best supplier in the field for advanced assembly capabilities. With extensive assembly equipment for every need and inspection technologies to boot- the opportunity to assemble […]

The Flex Printed Circuits, Mastered

Innovations, progress and ingenuity. All of the former can be found in the field of Flex Printed Circuits. At least regarding these solutions. The Flex Printed Circuits (FPC) field has finally been mastered for every engineer’s enjoyment. With innovations by DYCONEX, a MST division, which have redefined the boundaries of tech creativity and the dictionary’s […]

The Flexed PCB

The full mastery of Flex and Flex Rigidized PCB tech can be yours. The cutting-edge multilayer tech is now fully tailored to your needs with DYCONEX. Multilayered Flex PCBs, HDI, 3D miniaturization, and ultra-fine line cables. These are just some of the cutting edge mastery of the multilayered Flex and Flex Rigidized PCB tech by […]

The Low Temperature Co-Fired Ceramic

Multilayered substrate technology offering excellent RF and Microwave performance characteristics. The low sintering  temperature (900c approximately) allows co-firing with  highly conductive metals such as silver and gold. Low Temperature Co-Fired Ceramic (LTCC) Substrates are  supported by Tech board gizmo MSE, division of tech provider MST, to alleviate and upgrade RF and Microwave  performance. How? the […]