LTCC Substrates Hybrid & MCM Capabilities & Assemblies

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 Full range of Hybrid & MCM capabilities & Assemblies:
– Design and manufacture of microelectronic substrates & assemblies.
– Hybrid & MCM design & manufacturing.
– Design & manufacture of complex LTCC substrates.
– Advanced assembly and semiconductor packaging processes.
– Development and manufacturing of complete electronic modules of active implants, SMD assembly and test.